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dc.contributor.authorACKLAND, KARLen
dc.contributor.authorCOEY, JOHNen
dc.date.accessioned2014-04-22T10:41:50Z
dc.date.available2014-04-22T10:41:50Z
dc.date.issued2012en
dc.date.submitted2012en
dc.identifier.citationDunne, P, Soucaille, R, Ackland, K, Coey, JMD, Magnetic structuring of linear copper electrodeposits, Journal of Applied Physics, 111, 2012, 07B915 -en
dc.identifier.otherYen
dc.identifier.urihttp://hdl.handle.net/2262/68508
dc.descriptionPUBLISHEDen
dc.description.abstractElectrodeposition of copper is investigated in localized magnetic fields produced by linear arrays of permanent magnets. The thickness and texture of the deposits depend on the magnitude and direction of the field. The deposition rate is explained in terms of magnetic pressure on the diffusion layer. Addition of non-electroactive GdCl 3 to the electrolyte inverts the structuring of the electrodeposits, producing thick dendritic growth in regions where the field is smallest.en
dc.format.extent07B915en
dc.language.isoenen
dc.relation.ispartofseriesJournal of Applied Physicsen
dc.relation.ispartofseries111en
dc.rightsYen
dc.subjectPhysicsen
dc.titleMagnetic structuring of linear copper electrodepositsen
dc.typeJournal Articleen
dc.contributor.sponsorScience Foundation Ireland (SFI)en
dc.contributor.sponsorIrish Research Council for Science and Engineering Technology (IRCSET)en
dc.type.supercollectionscholarly_publicationsen
dc.type.supercollectionrefereed_publicationsen
dc.identifier.peoplefinderurlhttp://people.tcd.ie/jcoeyen
dc.identifier.rssinternalid93649en
dc.identifier.doihttp://dx.doi.org/10.1063/1.3678295en
dc.rights.ecaccessrightsOpenAccess


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