Solvent-Engineered Stress in Nanoscale Materials?
Item Type:Journal Article
Citation:Shaun Mills, Chiara Rotella, Eoin K. McCarthy, David J. Hill, Jing-Jing Wang,, Solvent-Engineered Stress in Nanoscale Materials?, ACS Appl. Mater. Interfaces, 10, 2018, 44183 - 44189
Solvent-Engineered Stress in Nanoscale Materials.pdf (Pre-print (author's copy) - Non-Peer Reviewed) 1.070Mb
Nanoscale materials are frequently coated with surface stabilisation layers during growth that prevent flocculation in solution and facilitate processing technologies such ink-jet device printing. Here, we show that few-nanometer thick stabilisation layers typically used swell in the presence of certain solvents and impart significant stresses into the nanomaterial that remains even after the solvent has evaporated. Solvent-swelling of the surface layer dramatically enhances nanomaterial-substrate adhesion via the collapse of the stabilisation layer during solvent evaporation, preventing stress relaxation. We demonstrate stress modulation of Ag, Au and Si nanowires functionalised with surface polymers and surfactant layers and detect strain levels of between 0.1% and 0.6% using AFM mechanical measurement and Raman spectroscopy. Dry-transferred nanowires exhibit poor adhesion and show no evidence of incorporated stress but become stressed immediately following solvent exposure. Strain engineering is demonstrated by coating nanowires with few nanometer thick solvent-responsive polymer layers.
Science Foundation Ireland
European Research Council
Australian Research Council Centre of Excellence in Exciton Science
Author: Boland, John
Type of material:Journal Article
Series/Report no:ACS Appl. Mater. Interfaces;
Availability:Full text available
Keywords:Nanomaterials, surface passivation, functionalisation, stress, strain-engineering, ink-jet