Please use this identifier to cite or link to this item:
http://hdl.handle.net/2262/65415
N.B. This item was not published by TCD.
Title:
Low-cost and versatile thermal test chip for power assemblies assessment and thermometric calibration purposes
Keywords:
thermal test chip thermometric calibration thermal model validation packaging power electronics
Issue Date:
12-Apr-2011
Publisher:
Elsevier
Abstract:
Abstract
Chips specifically designed for thermal tests such as the assessment of packages, are of main interest in Microelectronics. Nevertheless, these test dies are required in relatively low quantities and their price is a limiting factor. This work describes a low-cost thermal test chip, specifically developed for the needs of power electronics. It is based on a poly-silicon heating resistor and a decoupled Pt temperature sensing resistor on the top, allowing to dissipate more than 60W (170W/cm2) and reaching temperatures up to 200°C. Its simple structure allows an easy simulation and modeling. These features have been taken in profit for packaging materials assessment, calibration of temperature measurement apparatus and methods, and validation of thermal models and simulations.
Please note: There is a known bug in some browsers that causes an
error when a user tries to view large pdf file within the browser window.
If you receive the message "The file is damaged and could not be
repaired", please try one of the solutions linked below based on the
browser you are using.
Items in TARA are protected by copyright, with all rights reserved, unless otherwise indicated.